Oxford Instruments PlasmaPro 1000

Review Cycle

February 2026

Oxford Instruments PlasmaPro 1000
Source: www.oxinst.com

Introduction to PlasmaPro 1000

The PlasmaPro 1000 is a state-of-the-art plasma processing system developed by Oxford Instruments. This system is designed to provide high-performance plasma processing capabilities for semiconductor fabrication, including etching, deposition, and surface modification. The PlasmaPro 1000 utilizes advanced plasma technology to achieve fast processing rates, high uniformity, and low damage to the wafer surface.

Architecture and Components

The PlasmaPro 1000 consists of several key components, including the process chamber, plasma source, and control system. The process chamber is designed to accommodate wafers up to 200mm in size and is equipped with advanced plasma shielding and protection systems. The plasma source is a high-density plasma generator that provides fast and efficient plasma processing. The control system is a sophisticated software and hardware platform that enables precise control over the plasma processing parameters.

Specifications

The following table summarizes the key specifications of the Oxford Instruments PlasmaPro 1000:

Performance and Benchmarks

The PlasmaPro 1000 has demonstrated excellent performance and benchmarks in various semiconductor fabrication applications. The system's high-density plasma capability enables fast etching and deposition rates, while its advanced control system ensures precise control over the plasma processing parameters. The PlasmaPro 1000 has been used in various fabrication processes, including the production of microelectronics, optoelectronics, and nanotechnology devices.
What is the maximum wafer size that can be processed by the PlasmaPro 1000?

The PlasmaPro 1000 can process wafers up to 200mm in size.

What type of plasma source is used in the PlasmaPro 1000?

The PlasmaPro 1000 uses a high-density plasma generator as its plasma source.

What is the typical etching rate of the PlasmaPro 1000?

The typical etching rate of the PlasmaPro 1000 is up to 10 μm/min.

Is the PlasmaPro 1000 suitable for high-volume production?

Yes, the PlasmaPro 1000 is designed for high-volume production and can handle large quantities of wafers.

Specifications

System Type Plasma Processing System
Wafer Size Up to 200mm
Plasma Source High-Density Plasma Generator
Process Chamber Advanced Plasma Shielding and Protection
Control System Sophisticated Software and Hardware Platform
Etching Rate Up to 10 μm/min
Deposition Rate Up to 5 μm/min
Uniformity < 5%