Executive Summary

The Veeco Instruments Unaxis 790 is a versatile and widely used semiconductor fabrication tool, specifically designed for reactive ion etching (RIE) and plasma-enhanced chemical vapor deposition (PECVD) processes. This system is utilized in various applications, including the fabrication of compound semiconductors, silicon dioxide, and silicon nitride. With its advanced architecture and design, the Unaxis 790 offers a high degree of flexibility and precision, making it an essential tool for research and development in the semiconductor industry.

The Unaxis 790 series RIE is used to etch various materials, such as silicon dioxide, silicon nitride, and polymers, from the surface of a substrate using reactive gases in a radio frequency (RF) induced plasma. The system's temperature control capabilities allow for a wide range of temperatures, from as low as -50°C, making it suitable for various fabrication processes. The Unaxis 790 also features a range of standard heat exchanger options, which accommodate different temperature control requirements.

Architecture & Design

The Unaxis 790's architecture is based on a parallel plate plasma etching system, which uses ionized fluorocarbon gases and oxygen to etch polymer and dielectric materials. The system's design allows for a high degree of customization, with various options for temperature control, gas flow, and RF power. The Unaxis 790 also features a range of safety features, including interlocks and emergency shutdown procedures, to ensure safe operation and minimize the risk of accidents.

The system's PECVD process is used to deposit thin films of silicon dioxide and silicon nitride onto substrates. The PECVD process involves the reaction of gas precursors in a plasma environment, resulting in the deposition of a thin film. The Unaxis 790's PECVD system is capable of depositing films with high uniformity and precision, making it suitable for a range of applications, including the fabrication of microelectronic devices.

The Unaxis 790's design also incorporates a range of advanced features, including a tunable laser spectrometer, which allows for the measurement of emission rates of carbon dioxide and methane. The system's software release notes and operating checklist provide detailed information on the system's operation and maintenance, ensuring that users can optimize the system's performance and minimize downtime.

Performance & Thermal

The Unaxis 790's performance is characterized by its ability to etch and deposit materials with high precision and uniformity. The system's RF power and gas flow rates can be adjusted to optimize the etching and deposition processes, resulting in high-quality films and patterns. The Unaxis 790's temperature control capabilities also play a critical role in its performance, allowing for precise control over the substrate temperature during the fabrication process.

The system's thermal performance is also an important consideration, as excessive heat can damage the substrate or affect the quality of the films deposited. The Unaxis 790's heat exchanger options and temperature control systems are designed to minimize thermal gradients and ensure uniform heating and cooling of the substrate. Exact figures for the system's thermal design power (TDP) were not publicly disclosed, but the system's design and architecture suggest a high degree of thermal management and control.

Benchmarks for the Unaxis 790's performance are not readily available, but the system's capabilities and features suggest that it is a high-performance tool, suitable for a range of demanding applications. The system's software release notes and operating checklist provide detailed information on the system's operation and maintenance, ensuring that users can optimize the system's performance and minimize downtime.

Market Positioning

The Unaxis 790 is positioned as a high-end semiconductor fabrication tool, suitable for research and development applications. The system's advanced features and capabilities make it an attractive option for users who require high precision and flexibility in their fabrication processes. The Unaxis 790's competitors in the market include other RIE and PECVD systems, such as the Lam AutoEtch 490 plasma etcher and the Matrix 105 plasma etcher.

The Unaxis 790's target buyer is likely to be a research institution or a semiconductor fabrication facility, looking for a high-performance tool for RIE and PECVD processes. The system's advanced features and capabilities make it an attractive option for users who require high precision and flexibility in their fabrication processes. The Unaxis 790's price is not publicly disclosed, but it is likely to be a significant investment, given the system's advanced features and capabilities.